Capabilities
What we can manufacture: layer counts, materials, tolerances and finishes at a glance.
Use this page to check your design against our manufacturing limits before you request a quote. The interactive matrix below covers layer counts, board sizes, tracks and gaps, hole tolerances, materials, surface finishes and testing, and you can download the full matrix as a PDF to share with your team.
Headline capability: multilayers up to 40 layers, heavy copper up to 24oz, 50 micron (2 thou) fine-line tracks, single and differential controlled impedance, blind and buried vias, copper fill, resin fill and metal-backed PCBs.
These figures are a general guide, not hard limits. If your design pushes beyond them, call our Technical Department on +44 (0)1952 670011. We encourage a DFM review at prototype stage to maximise yields on production batches.
Capabilities at a glance
| Parameter | Capability |
|---|---|
| Layer counts | Conventional/PTH: 2 layers. Multilayer: up to 40 layers. Flex: 2 layers. Flex-rigid: 2 layers plus rigid. Multilayer flex-rigid: up to 16 layers. |
| Board thickness | Conventional 0.05-4.8mm. Multilayer 0.3-8.5mm. Flex 0.05-0.4mm. Flex-rigid 0.2-4.8mm. Multilayer flex-rigid 0.2-3.2mm. |
| Max circuit size | 660 x 533mm (26 x 21in); manufacturing panel 711 x 584mm (28 x 23in) |
| Copper weights | 0.25oz (9µm) to 24oz (840µm) heavy copper |
| Min track / gap | 3 thou (0.076mm) at 0.25oz copper; 50 micron (2 thou) tracks by arrangement |
| Holes | Min finished hole 0.05mm; max drilled hole 6.0mm; positional tolerance from CAD data +/- 0.038mm |
| Min annular ring | 0.076mm (3 thou) |
| Materials | Standard and high-performance FR4, polyimide, IMS, high-speed/low-loss laminates. Arlon, Isola, DuPont, Taconic, Rogers, Ventec. Extensive UK stock. |
| Solder resist | All types; 25µm over surface patterns; green, red, blue, black, clear, white, yellow; gloss, semi-gloss or matt |
| Ident / notation | Screen print or ink jet; min line 0.1mm; white, yellow, black, blue, red, purple, orange |
| Surface finishes | LF HASL, HASL 63/37, immersion silver, ENIG, ENEPIG, electrolytic Ni/Au, carbon ink |
| Profile | NC routing +/- 0.1mm (special +/- 0.05mm); scoring; depth-controlled routing, drilling and milling; chamfers 20, 30, 35 and 45 degrees |
| Testing | 100% electrical test to data; 3 x AOI for inner layers; ATG flying probe 0-500V, test area 520 x 400mm; IPC-D-356 netlist preferred |
| Standards | BS EN ISO 9001:2015 (BSI), JOSCAR, UL 796, Cyber Essentials; IPC Class 2, Class 3 processes available |
Design rules: minimum tracks and gaps by copper weight
| Copper | Min track thou (mm) | Min gap inner thou (mm) | Min gap outer thou (mm) |
|---|---|---|---|
| 0.25 oz | 3 (0.076) | 3 (0.076) | 3 (0.076) |
| 0.50 oz | 4 (0.102) | 4 (0.102) | 4 (0.102) |
| 1.00 oz | 5 (0.127) | 5 (0.127) | 5 (0.127) |
| 2.00 oz | 8 (0.203) | 8 (0.203) | 6 (0.152) |
| 3.00 oz | 12 (0.304) | 10 (0.254) | 8 (0.203) |
| 4.00 oz | 12 (0.304) | 12 (0.304) | 10 (0.254) |
| 5.00 oz | 12 (0.304) | 14 (0.355) | 12 (0.304) |
| 6.00 oz | 12 (0.304) | 16 (0.406) | 14 (0.355) |
| 7.00 oz | 12 (0.304) | 18 (0.457) | 16 (0.406) |
| 8.00 oz | 12 (0.304) | 20 (0.508) | 18 (0.457) |
| 9.00 oz | 12 (0.304) | 22 (0.559) | 20 (0.508) |
| 10.00 oz | 12 (0.304) | 24 (0.610) | 22 (0.559) |
| 11.00 oz | 12 (0.304) | 26 (0.660) | 24 (0.610) |
| 12.00 oz | 12 (0.304) | 28 (0.711) | 26 (0.660) |
Copper weights above 12oz (up to 24oz): please discuss your design with our Technical Department on +44 (0)1952 670011.
Solderable finishes
| Finish | Typical use | Thickness |
|---|---|---|
| Hot Air Solder Level (63/37) | General purpose | 4-40µm |
| Lead Free HASL (SN100C) | General purpose | 4-40µm |
| Immersion silver | Flat pad for fine pitch | 1-1.2µm |
| ENIG (immersion gold) | Flat pad for fine pitch | 0.08-0.12µm Au and 3-5µm Ni |
| ENEPIG | Wire bonding | 0.03-0.07µm Au, 3-6µm Ni and 0.06-0.3µm Pd |
| Electrolytic Ni/Au | Edge connectors, key pads, contact pads | 0.1-5.0µm Au, 1.0-10.0µm Ni |
| Carbon ink | Key pads | 10-25µm |
All finishes meet RoHS requirements other than HASL 63/37.
Detailed capabilities
Everything below expands on the matrix above. Open a section for the full tolerances and options. All figures are a general guide: call our Technical Department on +44 (0)1952 670011 if your design goes beyond them.
Design data: what to send us
Preferred format: Extended Gerber RS274X. Also accepted: ODB++, DXF, DPF, HPGL (drawings), Standard Gerber RS274D with aperture lists, Excellon and Sieb & Meyer drill files, IPC-D-356 and Mentor netlists.
Send with your enquiry:
- All layers as separate files, including drill data
- Solder resist, top and bottom
- Ident, peelable mask and via-plugging files where applicable
- Profile drawing with all tolerances stated
- Drill drawing showing hole positions and sizes
For multilayers, also state: build details (material type, thickness, copper weights), circuit dimensions, panelisation details including fiducials and tooling holes, release standards required (C of C, UL, IPC-A-600 Class 2), special requirements such as high-voltage test or controlled impedance, solderable finish, gold plating details including edge connector chamfers, and solder resist and silk screen type and colour.
Board types, layer counts and sizes
| PCB type | Max layers | Board thickness |
|---|---|---|
| Conventional / PTH | 2 | 0.05 to 4.8mm |
| Multilayer | 40 | 0.3 to 8.5mm |
| Flex | 2 | 0.05 to 0.4mm |
| Flex-rigid | 2 plus rigid | 0.2 to 4.8mm |
| Multilayer flex-rigid | 16 | 0.2 to 3.2mm |
Maximum circuit size 660 x 533mm (26 x 21in). Maximum manufacturing panel 711 x 584mm (28 x 23in).
Materials, cores and copper weights
We manufacture in most materials, from cost-efficient FR4 through to very high speed, low loss laminates: standard and high-performance FR4, polyimide, IMS and EMC. Brands held in UK stock include Arlon, Isola, DuPont, Taconic, Rogers and Ventec.
Standard FR4 cores (mm): 0.1, 0.125, 0.2, 0.25, 0.3, 0.35, 0.4, 0.5, 0.6, 0.711, 0.76, 0.88, 0.91, 1.0, 1.08, 1.57
FR4 prepregs: 106 (0.037mm), 1080 (0.06mm), 2125 (0.09mm), 2113 (0.1mm), 2116 (0.112mm), 7628 (0.18mm)
Copper weights: 0.25oz (9µm) to 24oz (840µm) in standard steps. Please discuss designs above 12oz with our Technical Department.
Holes, pads and registration
Hole sizes: minimum finished hole 0.05mm; maximum drilled hole 6.0mm.
| Hole diameter | Drilled tolerance | Plated tolerance |
|---|---|---|
| Up to 1.0mm | +/- 0.025mm | +/- 0.050mm |
| 1.0 to 2.0mm | +/- 0.038mm | +/- 0.076mm |
| Over 2.0mm | +/- 0.050mm | +/- 0.087mm |
Hole position: 0.038mm from CAD data; 0.076mm from outer layer artworks.
Registration tolerances: drill position +/- 0.038mm; pad position +/- 0.025mm; photo location +/- 0.076mm; etch factor 0.013mm; minimum annular ring 0.076mm; total manufacturing tolerance 0.216mm.
Pad/hole ratio guide: for a 1.0mm hole allow a 1.46mm pad on outer layers (1:1.46) and 1:1.42 on inner layers to achieve tangency. Layer-to-layer registration capability is +/- 0.2mm per pair of layers, depending on material thickness and copper weight.
Plating thicknesses: gold 2.5µm +/- 0.25 (allowance +0.10mm); tin/lead 7.5µm +/- 1.0 (allowance +0.15mm); nickel/gold 2.5µm +/- 0.5 (allowance +0.10mm).
Tracks and gaps
Minimum track and gap depend on copper weight: see the design rules table in the matrix above. Two rules of thumb for layout: allow at least 0.1mm clearance between pads and tracks, and 0.2mm between holes and tracks. 50 micron (2 thou) tracks are available by arrangement.
Solder resist and component ident
Solder resist: all types available; 25µm over surface patterns; colours green, red, blue, black, clear, white and yellow; gloss, semi-gloss or matt finish; 0.05mm clearance required on pads.
Component ident: screen print or ink jet (ink jet in white only). Minimum line 0.1mm, standard 0.2mm. Colours: white, yellow, black, blue, red, purple, orange. Alignment tolerance +/- 0.2mm. Keep ident at least 0.3mm from any solderable feature.
Surface finishes
LF HASL (SN100C), HASL 63/37, immersion silver, ENIG, ENEPIG, electrolytic Ni/Au and carbon ink: full thickness details are in the matrix above. All finishes meet RoHS requirements other than HASL 63/37. Talk to us about the right finish for your assembly process.
Testing
Every PCB is 100% electrically tested to data: inner layers are verified by AOI (3 x Orbotech machines) before bonding, and finished boards are tested on ATG high-voltage flying probe testers (2 x A3, 1 x A5).
ATG capability: 0 to 500V, 3 to 30mA, measuring range 1 ohm to 1k ohm and 0.5M ohm to 10M ohm, test area 520 x 400mm.
Please supply an IPC-D-356 netlist with your data whenever possible.
Profiling and routing
NC routing to +/- 0.1mm (special tolerance +/- 0.05mm available). Cutting tools from 0.6 to 2.4mm as standard. Depth-controlled routing, drilling and milling to +/- 0.2mm. Scoring available. Edge connector chamfers of 20, 30, 35 and 45 degrees.