Capabilities

caps-imgWrekin Circuits has a Capability that covers a wide range of Technologies and Market sectors.

We have a wealth of experience regarding R&D programmes to develop new process technologies and products.

Some special features such as heavy copper plating (max 15oz), 50 micron (2 thou) tracks, and differential controlled impedance and blind and buried vias.

Copper / silver fill technology and metal backed PCB’s are a testament to the technical capability of our high technology service orientated company.

Capability is stated in the subsections below but this is a general guide only.

Please contact our Technical Department to discuss your requirements. We actively encourage DFM support for prototyping to maximise yields on production batches.

  • Data Formats

    We can accept all data formats including:
    DXF
    ODB++
    Extended Gerber RS274X (Preferred)
    Standard Gerber RS274D to include aperture lists
    DPF
    HPGL (for drawing)
    Excellon (drill files) SIEB Meyer (drill files)
    IPC-D-356 (netlist files) Mentor (netlist files)

    (Please contact our technical department should you require DFM support)

    What data is required?

    All layers including drill supplied as separate files
    Solder resist - top and bottom
    If applicable, ident, peelable masks and masks for plugging vias.
    Profile drawing with all tolerances stated
    Drill drawing to identify the positions and sizes of the holes.

    PCB details

    Build for multilayer’s including material type, thickness and copper weights
    Circuit dimensions
    Panelisation information if not supplied as a single circuit including fiducial and tooling hole requirements
    Release and Quality Standards required e.g. C of C, UL, CECC, and IPC-A-600 Class 2
    Special requirements e.g. High voltage test, controlled impedance
    Solderable finish e.g. LF HASL, HASL, ENIG, tin, silver
    Gold plating - e.g. Hard gold, soft gold, including chamfer details for edge connectors
    Solder resist - type e.g. Gloss, semi gloss, matt
    Colour e.g. Green, white, red, blue, clear, yellow, and black
    Silk screen ident - type and colour as above.

  • PCB Sizes

    MAXIMUM LAYER COUNT

    PCB TYPELAYER COUNT
    CONVENTIONAL/PTHS 2
    MULTI-LAYER 36
    FLEX 2
    FLEX RIGID 2 PLUS RIGID
    MULTI-LAYER FLEX RIGID 16

    MINIMUM/MAXIMUM BOARD THICKNESS

    TYPEMINMAX
    CONV/PTHS 0.05 mm
    0.002 thou
    4.8 mm
    0.189 thou
    MULTI-LAYER 0.3 mm
    0.118 thou
    8.5 mm
    0.334 thou
    FLEX 0.05 mm
    0.002 thou
    0.4 mm
    0.016 thou
    FLEX RIGID 0.2 mm
    0.008 thou
    4.8 mm
    0.189 thou
    MULTI-LAYER FLEX RIGID 0.2 mm
    0.008 thou
    3.2 mm
    0.125 thou

    MAXIMUM BOARD SIZES AND MANUFACTURING SIZE

    TYPECIRCUIT SIZE IN INCHESCIRCUIT SIZE IN MMManufacturing panel size in InchesManufacturing panel size in MM
    CONVENTIONAL 34 X 16 864 X 406 36 X 18 914 X 457
    PTH 34 X 16 864 X 406 36 X 18 914 X 457
    MULTI-LAYER FLEX RIGID 26 X 21 660 X 533 28 X 23 711 X 584
  • Substrates / Materials

    Wrekin Circuits manufacture using most materials from cost efficient through to very high speed / low loss applications. These include Standard and High performance FR4’s and Polyimides.

    Materials include Arlon, Isola, IMS, Nelco,Rogers and Ventec.

    Standard core thickness (mm) (fr4)

    0.1, 0.125, 0.2, 0.25, 0.3, 0.35, 0.4, 0.5, 0.6, 0.711, 0.76, 0.88, 0.910, 0.910, 1.00, 1.08, 1.57.

    FR4 prepreg codes and thickness

    106 - 0.037mm thick
    1080 - 0.06 mm thick
    2125 - 0.09 mm thick
    2113 - 0.1 mm thick
    2116 - 0.112 mm thick
    7628 - 0.18 mm thick

    Copper weights available

    0.25 oz ( 9 microns )
    0.33 oz ( 12 microns )
    0.50 oz ( 17.5 microns )
    1.0 oz ( 35 microns )
    2.0 oz ( 70 microns )
    3.0 oz ( 105 microns )
    4.0 oz ( 140 microns )
    5.0 oz ( 175 microns )
    6.0 oz ( 210 micron )
    7.0 oz ( 245 micron )
    8.0 oz ( 280 micron )
    9.0 oz ( 315 micron )
    10 oz ( 350 micron )
    11 oz ( 385 micron )
    12 oz ( 420 micron )

    Wrekin Circuits currently produce 15oz copper finish please discuss requirement with our Technical Department

  • Holes and Pads

    HOLE SIZE / TOLERANCE 
    MINIMUM FINISHED HOLE SIZE 0.05mm / 0.002 thou
    MAXIMUM DRILLED HOLE SIZE 6.0mm
    DRILLED HOLE DIAMETER TOLERANCE  
    UP TO 1.0mm (0.039 THOU) +/- 0.025mm / 0.001 thou
    1.0mm / 0.039 THOU TO 2.0mm 0.078 THOU +/- 0.038mm / 0.0015 thou
    OVER 2.0mm / 0.008 THOU +/- 0.050mm / 0.002 thou
    DRILLED HOLES POSITIONAL TOLERANCE  
    HOLE POSITIONS LOCATED FROM OUTER LAYER ARTWORKS 0.076mm / 0.003 thou
    HOLE POSITION FROM CAD DATA 0.038mm / 0.0015 thou
    PLATED HOLE DIAMETER TOLERANCE  
    UP TO 1.0mm 0.004 THOU +/- 0.050mm / 0.002 thou
    1mm / 0.004 THOU TO 2.00mm / 0.078 THOU +/- 0.076mm / 0.003 thou
    OVER 2mm / 0.078 THOU +/- 0.087mm / 0.0035 thou

     

    REGISTRATION TOLERANCE ( PAD / HOLE RATIO ) 
    DRILL POSITION TOLERANCE +/- 0.038mm / 0.0015 thou
    PAD POSITION TOLERANCE +/- 0.025mm / 0.001 thou
    PHOTO LOCATION TOLERANCE +/- 0.076mm / 0.003 thou
    ETCH FACTOR - 0.013mm / 0.0005 thou
    MIN. ANNULAR RING REQUIREMENTS 0.076mm / 0.003 thou
    TOTAL MANUFACTURE TOLERANCE 0.216mm / 0.0085 thou

    Outer layers: Ratio for a hole dia. of 1.0mm would then be 1:1.46, i.e. 1.46mm Pad minimum would be required to give land requirement of 0.076mm.

    Inner Layers: Ratio for a hole dia. of 1.0mm would be 1:1.42 to achieve tangency.

    Layer to Layer registration is dependant upon the accumulation of: Photo-location tolerance
    ( +/- 0.076mm ) Hard tooling tolerance ( +/- 0.025mm ) and the deviation due to pressing and etching. Pressing and etching deviations are dependant upon material thickness and copper weight per square metre. As a guide therefore, +/- 0.2mm registration tolerance per pair of layers is the capability.

    PLATING THICKNESS CONTROL

    PLATING TYPETHICKNESSPLATING ALLOWANCE
    GOLD PLATING 2.5 microns +/- 0.25 +0.10mm (0.004 thou)
    TIN / LEAD PLATING 7.5 microns +/- 1.0 +0.15mm (0.006 thou)
    NICKEL / GOLD PLATING 2.5 microns +/- 0.5 +0.10mm (0.004 thou)
    IMMERSION TIN 1.0 to 1.2 microns +0.10mm (0.004 thou)
  • Tracks and Gaps

    Minimum conductor width 0.038mm / 0.0015 Thou

    Minimum track widths vary with the copper weight being used.

    Generally a minimum of 0.1mm clearance is required between the pad and the tracks, and 0.2mm between a hole and the tracks.

    DESIGN GUIDELINES

    COPPERMINIMUM TRACK
    THOU/(mm)
    MINIMUM GAPS
    THOU/(mm)
    0.25 oz 3 (0.0762) 3 (0.0762)
    0.50 oz 4 (0.1016) 4 (0.1016)
    1.00 oz 5 (0.1270) 5 (0.1270)
    2.00 oz 8 (0.2032) 8 (0.2032)
    3.00 oz 12 (0.3048) 9 (0.2286)
    4.00 oz 16 (0.4064) 10 (0.2540)
    5.00 oz 20 (0.5080) 12 (0.3048)
    6.00 oz 24 (0.6096) 13 (0.3302)
    7.00 oz 24 (0.6096) 14 (0.3556)
    8.00 oz 24 (0.6096) 15 (0.381)
    9.00 oz 26 (0.6604) 16 (0.4064)
    10.00 oz 26 (0.6604) 17 (0.4318)
    11.00 oz 28 (0.7112) 18 (0.4572)
    12.00 oz 28 (0.7112) 19 (0.4826)

    Please discuss high copper weight designs with our Technical Department

  • Solder Resist

    Type – All types available.

    If not specified Electra EMP110/5060 Dark Green Gloss is used as standard.

    Thickness – 25 um over surface patterns.

    Colours available - green, red, blue, black, clear, white, yellow.
    Finish- Gloss, semi-gloss, matt.

    Clearance required on pads 0.05mm.

    Component Notation

    Notations are applied by either manual screen printing or Ink jet printing (White only).

    Minimum line features 0.1mm.
    Standard line features 0.2mm.

    Colours available – white, yellow, black, blue, red.

    Alignment positional tolerance +/- 0.2mm / 0.008 thou.

    Note that the designed ident should be a minimum of 0.3mm away from any solderable feature.

    solder resist2Solder resist1

  • Surface Finishes

    SOLDERABLE FINISHES

    SOLDERABLE FINISHTYPICAL USETHICKNESS
    HOT AIR SOLDER LEVEL (63/37) GENERAL PURPOSE 4 - 40 Um
    LEAD FREE H.A.S.L (SN100C) GENERAL PURPOSE 4 - 40 Um
    IMMERSION SILVER FLAT PAD FOR FINE PITCH 1 - 1.2 Um
    OSP FLAT PAD FOR FINE PITCH 0.1 – 0.3 Um
    IMMERSION TIN FLAT PAD FOR FINE PITCH
    DEVICES AND BACKPLANES
    1 - 1.2 Um
    ENIG (IMMERSION GOLD) FLAT PAD FOR FINE PITCH 0.08 - 0.12 Um Au & 3-5 Um NI
    SOFT / PURE GOLD WIRE BONDING 0.03 – 0.07 Um Au, 3 - 6 Um NI & 0.06 – 0.3 Um Pd
    HARD GOLD EDGE CONNECTORS
    KEY PADS, CONTACT PADS
    2.5 Um
    CARBON INK KEY PADS 10 - 25 Um

    Wrekin circuits offer a wide range of finishes to suit all technologies, applications and assembly methodologies.

    They all meet the requirements of RoHS other than HASL 63/37.

    Contact Wrekin Circuits Technical Department for further advice.

  • Test

    All PCB's are 100% tested to data. This includes inner layers pre bonding and final circuit test on completion of production.

    test

    Whenever possible please supply an IPC-D-356 Netlist.

    Our test departments includes 2off Orbotech Automated Optical Inspection machines (AOI) for inner layer verification and 2off A3 ATG High Voltage Flying Probe Testers for final test.

    ATG Capability

    Voltage 0-500v
    Current 3-30Ma
    Measuring range 1 ohm to 1K ohm
    0.5 M ohm to 10 M ohm
    Test area 520mm x 400mm

  • Profile

    Machine cutting positional and overall size standard tolerances
    NC Routing +/- 0.1mm / 0.004 thou

    Special tolerance +/- 0.05mm /0.002 thou

    Cutting tools available from 0.6mm to 2.4mm (standard)

    Depth controlled routing / drilling / milling with positional tolerance +/- 0.2mm

    Chamfers of 20,30,35 and 45 degrees available on edge connectors

    Scoring

  • Manufacturing Equipment

    PLOTTING & ENGINEERING

    Barco Silver Writer Photo plotter
    Film Processor
    Polar CITS /TDR differential impedance tester

    PRE PRODUCTION

    Cirgraphics 411 Vacuum exposure unit
    Folex Helamat developing unit
    Optek Film scanner

    STORES / MATERIAL ISSUE

    Guillotine
    Copper thickness measurement

    DRILLING

    XRC Combi Drill
    Vista X-Ray Pluritec
    Copper planeriser
    XL5 Linear (5 head) x 3
    Lenz x2 (2 head)
    Dust extraction system
    Various measuring equipment

    PHOTOMECH

    Phototechnic clean machine
    Ozatec HRL 600 (laminator)
    Dupont HRL 24
    DSR Littlejohn 300 (UV exposure unit)
    Cirgraphics T4000
    Cirgraphics T3000
    Muscat Dry Film developer
    Nubal Solder resist developer
    Boham Engineering laminate punch
    Air / humidity conditioning

    MULTILAYER

    Drying oven
    Prepreg/ material storage cabinet
    Burkle 4 day light vacuum press
    Burkle 2 day light vacuum press
    Piergiacomi SUD pre preg
    Weld machine

    CHEMICAL PROCESS AREA

    Electroless copper/ desmear plating line Veratronic
    Electrolytic plating line Veratronic and CMI
    Copper filtration system
    Surface Finish Processing : Immersion silver, OSP. ENIG, deep/hard gold
    Lantronic HASL 60/40 tin lead machine
    Pumiflex ultrathin and mechanical brush surface preparation machine
    Tin strip
    Oxide Sealbond process line
    Dry film resist strip Cemcut 30” Ammonical self dose etch machine
    CMI Caviderm

    SCREENING & IDENT

    Ink Jet ident machine
    2 x manual screen benches
    Ovens Curing machine

    PROFILE

    Datascore 700
    M100 profile
    RD100 profile micro drilling machine
    RDE 610 wash dry
    Pillar drill
    Beveller
    Dust extraction
    Various measuring equipment

    MISCELLANIOUS

    Compressors
    Sontex Packing Machine

    TEST & INSPECTION

    Orbotech SR1214
    Orbotech Discovery 6
    Tone Ohm
    ATG A3 X2 flying probe testers
    Cir-Kit Weld 350 Track Welder
    Eyes glasses, verniers, micrometers, light boxes, magnification

    LABORATORY

    Test equipment including:
    CEMCO Peel and pull
    CEMCO resistance analyser
    CEMCO Accelerated aging
    Solderability testing
    Microscope
    Change in resistance sand bath
    Fisons Humidity chamber
    Betascope Gold porosity tester
    Caviderm
    Microsection sanding machines/preparation
    Gold thickness measurement Fisher XRF measurement
    Chemical analysis

ADDRESS

Wrekin Circuits ltd

29/30 Hortonwood 33, Telford

Shropshire, TF1 7EX

CONTACT US

Tel: +44 (0)1952 670011

Email: sales@wrekin-circuits.co.uk